Compute Chips
The Post-Moore Path for AI Chips: Advanced Packaging Succeeds Process Scaling
For decades, the semiconductor industry rode a remarkably simple storyline: shrink transistors, pack more of them onto a die, and enjoy automatic gains in performance and efficiency. That story—embodied in Moore’s Law—still matters, but for AI chips in the mid‑2020s it is no longer the sole, or even primary, driver of progress.
Global AI Accelerator Market Breaks $250B in 2026: A Supply Chain Teardown
By 2026, AI accelerators have moved from niche hardware to the beating heart of modern compute, powering everything from frontier model training to real‑time inference across clouds, enterprises, and edge devices. Crossing the $250 billion mark in annual market value is not just a milestone; it is a reflection of a vast, intricate supply chain that stretches from design labs and fabs to packaging houses, board makers, system integrators, and the services that wrap around them. Understanding how this value is created and captured requires a teardown of the AI accelerator supply chain, layer by layer.
AI Chip TDP Grows 50% Per Gen, Data Center Power Architecture Faces Reassessment
Over the past several AI chip generations, one trend has become impossible to ignore: thermal design power (TDP) is climbing at a pace that would have seemed extreme even a few years ago. When flagship accelerators and high‑end AI chips see TDP grow on the order of 50% per generation, the consequences extend far beyond chip packaging.
Practical Breakthroughs of Domestic EDA Tools in AI Chip Design (Huada/Prime)
As AI chips surge to the forefront of national technology strategies, attention has increasingly turned from fabs and packaging to a crucial but less visible layer: electronic design automation (EDA). For many years, domestic EDA tools lagged behind international leaders, limiting how far local firms could push advanced AI chip design without external dependencies.
Analyzing the Optimal Balance Between R&D Expense Ratio and Market Share for AI Chip Firms
AI chip companies sit at the center of one of the most capital‑intensive and innovation‑driven industries in the world. Their success depends on sustained, heavy investment in research and development, yet they must also deliver financial performance that satisfies investors, funds next‑generation fabs and packaging, and supports competitive pricing. The question of how much to spend on R&D—expressed as an R&D expense ratio relative to revenue—cannot be answered in isolation.
Competitive Landscape of AI Chip IP Licensing Models (ARM/RISC-V)
As AI chips move from niche accelerators to pervasive compute foundations in data centers, edge devices, and embedded systems, the way CPU and AI cores are licensed has become a strategic question rather than a mere technical detail. ARM’s established commercial IP licensing model and the rising ecosystem around RISC-V represent two contrasting philosophies: one offers mature, standardized cores under proprietary licenses;
FCF Inflection Point Forecasting Model for Leading AI Chip Companies
As AI chip companies mature from high‑growth stories into capital‑intensive platforms, investors increasingly focus on free cash flow (FCF) as the core signal of long‑term value creation. Revenue growth, unit shipments, and benchmark leadership still matter, but they no longer tell the full economic story. What ultimately determines whether a leading AI chip company justifies its valuation is when, and how, its investments in R&D, tape‑outs, capacity, and ecosystem translate into sustained, positive, and growing FCF. This transition moment is what we can call the FCF reflection point.
The Threat of In-House Chips: Deep Dive on Google TPU v7 vs. Amazon Trainium 3
The AI hardware landscape in 2026 is defined not just by traditional semiconductor vendors, but increasingly by hyperscalers building their own, deeply integrated silicon. Among the most important examples are Google’s TPU v7 and Amazon’s Trainium 3, two generations of in‑house accelerators aimed squarely at large‑scale AI training and inference in their respective clouds.
Die-to-Die Interconnect (UCIe/BoW) Breaks Multi-Chip Module Performance Bottlenecks
For years, multi‑chip modules (MCMs) and chiplet‑based designs have promised a way around the limits of monolithic system‑on‑chips: better yield, more flexible integration, and modular reuse of IP. Yet one constraint kept their potential in check—the performance bottlenecks at the interfaces between dies. As long as die‑to‑die links behaved more like “mini‑PCIE slots” than true on‑chip fabric, MCMs could not fully match the speed and efficiency of large single dies.
Interpreting the Surge in Secondary Market Trading Volume for AI Chips
The rapid rise of AI has created unprecedented demand for high‑end accelerators, from data‑center GPUs to custom AI chips and complete inference boards. As supply challenges, long lead times, and aggressive deployment plans collide, a secondary market for AI chips has emerged and grown dramatically.